Tony Chavez

Our Lab offers: Electromigration (EM) Testing: Conducted on both die-level and package-level interconnects. We provide low-stress currents down to hundreds of nano-amperes for testing advanced metal lines and vias. We also offer parallel testing at high currents, up to several amperes, for far-backend-of-the-line interconnects, including wafer-level chip scale package (WLCSP) solder balls, flip chip bumps,