Mira
Package and Water-Level Multi-Application Test System
- Qualitau Reliability
- Category: MIRA- Package & Wafer-Level Multi-Application Testing
![](https://qualitau.com/wp-content/uploads/2021/09/MIRA-Wide1.jpg)
The MIRA modular system allows for a wide variety of configurations to meet testing requirements for EM, Contact EM, Stress Migration, TSV and Silicon Photonics. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe.