Infinity
Package & wafer-level TDDB & HC testing
- Qualitau Reliability
- Category: Infinity – Package & Wafer-Level TDDB & HC Testing
QualiTau’s Infinity testing system features a flexible modular architecture, allowing for easy upgrades from a small-scale package or die test setup to a high-capacity test system. It supports both package and wafer-level testing. The system can accommodate up to 16 Source & Measurement Unit (SMU) cards, with each SMU offering up to 24 voltage sources, for a total of 384 sources. A wide range of SMU options is available to meet specific testing requirements.