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MIRA- Package & Wafer-Level Multi-Application Testing
Infinity – Package & Wafer-Level TDDB & HC Testing
ACE – Package Level Pulse EM
MIRA- Package & Wafer-Level Multi-Application Testing
Infinity – Package & Wafer-Level TDDB & HC Testing
ACE – Package Level Pulse EM
Probe Systems
300SA Semi- Auto Prober
Multi-Site Parallel Wafer-Level Probing System
300SA Semi- Auto Prober
Multi-Site Parallel Wafer-Level Probing System
Special Applications
300SA Integration With Fast Parametric Testers
RF Prober
High Voltage HTRB/H3TRB
Desktop Micro Oven
300SA Integration With Fast Parametric Testers
RF Prober
High Voltage HTRB/H3TRB
Desktop Micro Oven
Test Lab Services
QualiTau’s Test Lab Service
QualiTau’s Test Lab Service
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MIRA REAR-LOAD OVEN
Reliable and Versatile Oven
Qualitau
Reliability
MIRA- Package & Wafer-Level Multi-Application Testing
MIRA REAR-LOAD OVEN
Products
MIRA- Package & Wafer-Level Multi-Application Testing
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Reliability
Reliability
MIRA- Package & Wafer-Level Multi-Application Testing
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The MIRA modular system allows for a wide variety of configurations to meet testing requirements for EM, Contact EM, Stress Migration, TSV and Silicon Photonics. Any combination of four similar or different application modules can be accommodated by the MIRA mainframe.
Infinity – Package & Wafer-Level TDDB & HC Testing
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QualiTau’s Infinity testing system has a flexible modular architecture that enables easy upgrading from a few package or die test system to a high capacity test system and is available for package or wafer level testing. The system can have up to 16 Source & Measurement Unit (SMU) cards and each SMU has up to 24 voltage sources for a total of 384 sources. A wide variety of SMU options are available to fit your requirements.
ACE – Package Level Pulse EM
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Electromigration effects on semiconductor devices used under AC conditions have typically been approximated using ”corrected” results from DC testing. However, the ever-increasing miniaturization of components and the need to question the traditional DC to AC correction factors has produced a growing demand for advanced testing tools and techniques that more closely simulate ”real-world” degradation of devices used under AC conditions. To meet this demand, QualiTau has developed the the ACE2 electromigration pulsed testing.
Probe System
300SA Semi- Auto Prober
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This ultra high accuracy prober uses linear shaft motor technology along with a heat resistance granite base for unparalleled performance. This semi-automatic prober system offers a front loading setup for ease of use. The microscope bridge system offers full auto alignment capabilities thanks to its X-Y-Z automated travel. The system also offers a touch panel display and a thermaland tight light chamber supports the use of thermal chucks and shielding capabilities. Thanks to the various Multi-Pin options and QualiTau’s high performance field proven measurement systems, we are able to offer a true high capacity WLR system at a fraction of the cost.
Multi-Site Parallel Wafer-Level Probing System
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The QualiTau Multi-site Probe system is not just a probe card, but a complete probing solution for testing 10s to 100s of DUTs simultaneously. It includes the probe station, anti-vibration table, light tight enclosure, digital camera with high powered optics, optional vacuum hot chuck, multiple-pin mini-probe cards, and QualiTau’s patented technique of placing multiple probe cards across the surface of a wafer. This technique provides the positioners with multi-dimensional alignment control including global X, Y, Z and Theta adjustment on the chuck, X and Y adjustments on the rails, and X, Y, and Z fine adjustments on each positioner head
Special Applications
300SA Integration With Fast Parametric Testers
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In addition to supporting Infinity based SMUs, the 300SA prober may also be configured with a parametric tester for maximum flexibility. The 300SA is equipped to handle signals from an external source and route them to the appropriate manipulators or heads to measure devices on the wafer.
RF Prober
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The RF prober builds on the 300SA semi-automatic prober by adding RF probing capability. The frequency capability extends from the popular 40 GHz bandwidth to THz. Typically four micro-positioners are used, although more can be accommodated. The system can be turnkey based on your specifications, just the RF prober, or any situation in between. Moreover, the prober can be either an RF prober, a four-positioner DC prober, or a multi-site DC prober by swapping the platen.
High Voltage HTRB/H3TRB
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Infinity based SMUs may be configured with humidity chambers, enabling accelerated testing under high humidity, temperature and voltage stress. This includes H3TRB at high voltages required for modern wide band gap devices.
Desktop Micro Oven
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The Desktop μ-oven is the first ever stand-alone oven system compatible with all brands of parametric testers. The stand-alone μ-oven’s DUT board is capable of high precision temperature control of each socket independently for temperatures up to 350ºC. The μ-oven has a built-in oven controller with temperature display and can be controlled either manually or automatically via the COM port. It’s versatile interface allows connection to any parametric tester and includes 12 sets of connector inputs for either triax or mini-USB cables. The DUT board includes jumpering flexibility to connect to various pins on each of it’s 4, high temp, 28-pin, non-ZIF sockets.
Test Lab Services
QualiTau’s Test Lab Service
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QualiTau’s Test Lab service is ideal for both fabless companies and foundries seeking: Reliable, independent evaluation and analysis. “Virtual” capacity during times of under-capacity. Cost-effective means of performing tests on an irregular or infrequent basis. A way to perform additional qualifications that are not being provided by the foundry and get third party verification of foundry results. A productive and beneficial way to “test drive” the equipment before committing to a purchase.
MIRA REAR-LOAD OVEN
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