Qualitau

Mira

Package and Wafer-Level Multi-Application Test System

MIRA- Package & Wafer-Level Multi-Application Testing

The MIRA modular system offers a wide range of configurations to meet testing requirements for EM, Contact EM, Stress Migration, TSV, and Silicon Photonics. The MIRA mainframe can support any combination of up to four similar or different application modules, providing maximum flexibility for diverse testing needs.